Wafer Grinding Spindle Assembly from Mexico
Ultra-precision air-bearing spindle delivering constant velocity for semiconductor wafer backgrinding operations. HTS 8473.40.86.00 as critical component of heading 8472 wafer thinning equipment. Achieves final wafer thickness control to ±1μm.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify RPM range (thousands) and runout specs proving semiconductor precision
• Include mounting interface standardization docs
• Prevent classification as general machine tool spindles