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8473.40.86.00/Wafer Grinding Spindle Assembly/Mexico

Wafer Grinding Spindle Assembly from Mexico

Ultra-precision air-bearing spindle delivering constant velocity for semiconductor wafer backgrinding operations. HTS 8473.40.86.00 as critical component of heading 8472 wafer thinning equipment. Achieves final wafer thickness control to ±1μm.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Specify RPM range (thousands) and runout specs proving semiconductor precision

• Include mounting interface standardization docs

• Prevent classification as general machine tool spindles

Wafer Grinding Spindle Assembly from Mexico — Import Duty Rate | HTS 8473.40.86.00