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8473.40.86.00/Wafer Grinding Spindle Assembly/Japan

Wafer Grinding Spindle Assembly from Japan

Ultra-precision air-bearing spindle delivering constant velocity for semiconductor wafer backgrinding operations. HTS 8473.40.86.00 as critical component of heading 8472 wafer thinning equipment. Achieves final wafer thickness control to ±1μm.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify RPM range (thousands) and runout specs proving semiconductor precision

• Include mounting interface standardization docs

• Prevent classification as general machine tool spindles

Wafer Grinding Spindle Assembly from Japan — Import Duty Rate | HTS 8473.40.86.00