Wafer Grinding Spindle Assembly from Japan
Ultra-precision air-bearing spindle delivering constant velocity for semiconductor wafer backgrinding operations. HTS 8473.40.86.00 as critical component of heading 8472 wafer thinning equipment. Achieves final wafer thickness control to ±1μm.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify RPM range (thousands) and runout specs proving semiconductor precision
• Include mounting interface standardization docs
• Prevent classification as general machine tool spindles