8473.40.86.00/Wafer Grinding Spindle Assembly/Germany

Wafer Grinding Spindle Assembly from Germany

Ultra-precision air-bearing spindle delivering constant velocity for semiconductor wafer backgrinding operations. HTS 8473.40.86.00 as critical component of heading 8472 wafer thinning equipment. Achieves final wafer thickness control to ±1μm.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify RPM range (thousands) and runout specs proving semiconductor precision

• Include mounting interface standardization docs

• Prevent classification as general machine tool spindles

Wafer Grinding Spindle Assembly from Germany — Import Duty Rate | HTS 8473.40.86.00