Wafer Grinding Spindle Assembly from Canada
Ultra-precision air-bearing spindle delivering constant velocity for semiconductor wafer backgrinding operations. HTS 8473.40.86.00 as critical component of heading 8472 wafer thinning equipment. Achieves final wafer thickness control to ±1μm.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Specify RPM range (thousands) and runout specs proving semiconductor precision
• Include mounting interface standardization docs
• Prevent classification as general machine tool spindles