Wafer Edge Profiling Grinder from Japan
Specialized grinder that creates precise chamfered edges on semiconductor wafers to prevent chipping during handling and processing. HTS 8473.40.86.00 classification for wafer preparation accessories of heading 8472 machines. Maintains edge strength for high-volume fab handling.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify edge geometry tolerances (e.g
• 45° chamfer, 0.5mm width) in technical docs
• Confirm compatibility with robotic wafer handling systems
• Avoid classification as general parts finishing equipment