8473.40.86.00/Wafer Edge Profiling Grinder/Japan

Wafer Edge Profiling Grinder from Japan

Specialized grinder that creates precise chamfered edges on semiconductor wafers to prevent chipping during handling and processing. HTS 8473.40.86.00 classification for wafer preparation accessories of heading 8472 machines. Maintains edge strength for high-volume fab handling.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify edge geometry tolerances (e.g

• 45° chamfer, 0.5mm width) in technical docs

• Confirm compatibility with robotic wafer handling systems

• Avoid classification as general parts finishing equipment

Wafer Edge Profiling Grinder from Japan — Import Duty Rate | HTS 8473.40.86.00