Wafer Edge Profiling Grinder from Germany
Specialized grinder that creates precise chamfered edges on semiconductor wafers to prevent chipping during handling and processing. HTS 8473.40.86.00 classification for wafer preparation accessories of heading 8472 machines. Maintains edge strength for high-volume fab handling.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify edge geometry tolerances (e.g
• 45° chamfer, 0.5mm width) in technical docs
• Confirm compatibility with robotic wafer handling systems
• Avoid classification as general parts finishing equipment