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8473.40.86.00/Semiconductor Wafer Slicing Saw/Japan

Semiconductor Wafer Slicing Saw from Japan

Diamond wire or blade saw designed to slice ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. Classified under HTS 8473.40.86.00 as essential wafer manufacturing equipment for heading 8472 apparatus. Maintains crystal orientation during high-precision cutting.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Submit wafer thickness specifications (typically <500μm) proving semiconductor application

• Include dust collection system details as integral to cleanroom compatibility