8473.40.86.00/Semiconductor Wafer Slicing Saw/Germany

Semiconductor Wafer Slicing Saw from Germany

Diamond wire or blade saw designed to slice ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. Classified under HTS 8473.40.86.00 as essential wafer manufacturing equipment for heading 8472 apparatus. Maintains crystal orientation during high-precision cutting.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Submit wafer thickness specifications (typically <500μm) proving semiconductor application

• Include dust collection system details as integral to cleanroom compatibility

Semiconductor Wafer Slicing Saw from Germany — Import Duty Rate | HTS 8473.40.86.00