Semiconductor Wafer Slicing Saw from Germany
Diamond wire or blade saw designed to slice ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. Classified under HTS 8473.40.86.00 as essential wafer manufacturing equipment for heading 8472 apparatus. Maintains crystal orientation during high-precision cutting.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Submit wafer thickness specifications (typically <500μm) proving semiconductor application
• Include dust collection system details as integral to cleanroom compatibility