</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8473.40.86.00/Diamond Wire Wafer Saw Consumable Loader/Japan

Diamond Wire Wafer Saw Consumable Loader from Japan

Automated loading system for diamond wire spools and slurry systems in high-throughput wafer slicing saws. HTS 8473.40.86.00 as accessory suitable solely for heading 8472 semiconductor slicing machines. Enables continuous production operation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Calculate with your customs valueVerify classification with AI

Import Tips

• Prove exclusive compatibility with semiconductor wire saw formats

• Include cleanroom compatibility certifications

• Classify as integral part, not separate material handling equipment

Diamond Wire Wafer Saw Consumable Loader from Japan — Import Duty Rate | HTS 8473.40.86.00