Crystal Boule Grinder from China
Precision grinding machine that shapes semiconductor crystal boules to exact diameters and grinds orientation flats indicating conductivity type. Falls under HTS 8473.40.86.00 as wafer preparation equipment for heading 8472 machines. Ensures dimensional accuracy before wafer slicing.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Include engineering drawings showing semiconductor-specific tolerances in import documentation
• Certify equipment design prevents use with non-semiconductor crystals
• Avoid misdeclaration as general metalworking machinery under 8460