Chemical Mechanical Wafer Polisher from Germany
CMP polisher that uses chemical slurry and mechanical force to achieve atomic-level surface flatness on semiconductor wafers. Specifically classified in HTS 8473.40.86.00 as final wafer preparation apparatus for heading 8472 machines. Essential for subsequent device fabrication processes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Provide CMP process parameter specs (pressure, platen speed) proving semiconductor application
• Include endpoint detection system documentation as integral feature
• Distinguish from general optical polishing equipment