Wafer Lapping Machine Pressure Control Board from China
This PCA regulates pneumatic pressure systems in wafer lappers that achieve flatness tolerances for semiconductor wafer fabrication. It maintains nanometer-level uniformity across wafer surfaces. HTS 8473.30.11 as PCA for heading 8471 semiconductor processing equipment.
Duty Rate — China → United States
50%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Provide pressure regulation specifications (0.1 psi resolution) proving semiconductor tolerances
• Include slurry flow integration documentation for chemical-mechanical processes
• Certify materials compatibility with silicon carbide and diamond abrasives