Wafer Lapping Machine Pressure Control Board from Canada
This PCA regulates pneumatic pressure systems in wafer lappers that achieve flatness tolerances for semiconductor wafer fabrication. It maintains nanometer-level uniformity across wafer surfaces. HTS 8473.30.11 as PCA for heading 8471 semiconductor processing equipment.
Duty Rate — Canada → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Provide pressure regulation specifications (0.1 psi resolution) proving semiconductor tolerances
• Include slurry flow integration documentation for chemical-mechanical processes
• Certify materials compatibility with silicon carbide and diamond abrasives