Crystal Grinder Diameter Control PCA from Mexico
Printed circuit assembly for automated crystal grinders that shape semiconductor boules to precise wafer diameters and grind orientation flats. It processes laser measurement feedback for closed-loop diameter control. Classified in HTS 8473.30.11 for heading 8471 wafer preparation machines.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.05.860%Universal product exemption (U.S. note 52(b))
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Supply optical sensor integration specifications confirming semiconductor metrology standards
• Include vibration isolation design data for high-precision grinding operations
• Demonstrate via technical drawings that no CRT display drivers are incorporated