Industrial Cordless Rotary Drill for Wafer Grinding from Japan
Specialized cordless rotary drill adapted for semiconductor wafer grinding prep, self-contained motor with precision speed control. Fits HTS 8467.21.0050 other rotary; used in crystal boule processing per statistical notes.
Duty Rate — Japan → United States
11.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Reference statistical note (b) wafer grinders; may qualify for duty relief
• ESD-safe certification essential for semiconductor imports