Industrial Cordless Rotary Drill for Wafer Grinding from Japan
Specialized cordless rotary drill adapted for semiconductor wafer grinding prep, self-contained motor with precision speed control. Fits HTS 8467.21.0050 other rotary; used in crystal boule processing per statistical notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Reference statistical note (b) wafer grinders; may qualify for duty relief
• ESD-safe certification essential for semiconductor imports