8467.21.00.50/Industrial Cordless Rotary Drill for Wafer Grinding/Japan

Industrial Cordless Rotary Drill for Wafer Grinding from Japan

Specialized cordless rotary drill adapted for semiconductor wafer grinding prep, self-contained motor with precision speed control. Fits HTS 8467.21.0050 other rotary; used in crystal boule processing per statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Reference statistical note (b) wafer grinders; may qualify for duty relief

• ESD-safe certification essential for semiconductor imports