8466.93.98.85/Wafer Lapping Machine Work Holder/Japan

Wafer Lapping Machine Work Holder from Japan

Specialized work holder for double-sided lapping machines that simultaneously lap both surfaces of semiconductor wafers to achieve nanometer flatness. Falls under HTS 8466.93.98.85 as an accessory for semiconductor wafer preparation equipment of heading 8461. Features pin-plate carrier system for uniform pressure distribution.

Duty Rate — Japan → United States

14.7%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Provide flatness specification documentation (e.g

• <1μm across 300mm wafer); include carrier material composition for contamination control; verify pressure uniformity test data

Wafer Lapping Machine Work Holder from Japan — Import Duty Rate | HTS 8466.93.98.85