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8466.93.98.85/Wafer Lapping Machine Work Holder/Germany

Wafer Lapping Machine Work Holder from Germany

Specialized work holder for double-sided lapping machines that simultaneously lap both surfaces of semiconductor wafers to achieve nanometer flatness. Falls under HTS 8466.93.98.85 as an accessory for semiconductor wafer preparation equipment of heading 8461. Features pin-plate carrier system for uniform pressure distribution.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Provide flatness specification documentation (e.g

• <1μm across 300mm wafer); include carrier material composition for contamination control; verify pressure uniformity test data

Wafer Lapping Machine Work Holder from Germany — Import Duty Rate | HTS 8466.93.98.85