Wafer Lapping Machine Work Holder from China
Specialized work holder for double-sided lapping machines that simultaneously lap both surfaces of semiconductor wafers to achieve nanometer flatness. Falls under HTS 8466.93.98.85 as an accessory for semiconductor wafer preparation equipment of heading 8461. Features pin-plate carrier system for uniform pressure distribution.
Duty Rate — China → United States
42.2%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Provide flatness specification documentation (e.g
• <1μm across 300mm wafer); include carrier material composition for contamination control; verify pressure uniformity test data