8466.93.98.85/Silicon Boule Grinder Flattening Fixture/Japan

Silicon Boule Grinder Flattening Fixture from Japan

Precision fixture for grinding flats on silicon boules to indicate crystal orientation and resistivity type for subsequent wafer slicing. Classified under HTS 8466.93.98.85 as a special attachment for semiconductor crystal processing machines of heading 8461. Ensures repeatable flat positioning critical for wafer fabrication.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include angle tolerance specifications (typically ±0.5°); provide semiconductor doping indication correlation data; ensure fixture material prevents silicon contamination