Semiconductor Wafer Slicing Saw Spindle Assembly from China
Precision spindle assembly for inner diameter wafer slicing saws used to cut ultra-thin silicon wafers from monocrystalline boules in semiconductor fabrication. Classified under HTS 8466.93.98.85 as a key component for machines of heading 8461 dedicated to semiconductor wafer preparation. Features diamond-impregnated blade mounting for sub-micron accuracy.
Duty Rate — China → United States
42.2%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Include detailed engineering drawings showing semiconductor-specific tolerances; provide end-user statements confirming wafer fabrication use; watch for diamond content declarations affecting classification