Semiconductor Wafer Slicing Saw Spindle Assembly from Canada
Precision spindle assembly for inner diameter wafer slicing saws used to cut ultra-thin silicon wafers from monocrystalline boules in semiconductor fabrication. Classified under HTS 8466.93.98.85 as a key component for machines of heading 8461 dedicated to semiconductor wafer preparation. Features diamond-impregnated blade mounting for sub-micron accuracy.
Duty Rate — Canada → United States
14.7%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Include detailed engineering drawings showing semiconductor-specific tolerances; provide end-user statements confirming wafer fabrication use; watch for diamond content declarations affecting classification