Diamond Wafer Polishing Head Assembly from Mexico
Carrier head assembly with diamond pad retention system for chemical mechanical polishing (CMP) of semiconductor wafers. This part for heading 8461 polishing machines is classified in HTS 8466.93.98.85 due to its semiconductor-specific design tolerances. Maintains uniform pressure across 300mm wafers during planarization.
Duty Rate — Mexico → United States
14.7%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Document diamond pad pressure uniformity (<1% variation); include slurry compatibility specifications; provide contamination-free material certifications