Cast Iron Wafer Grinder Spindle Housing
Housing for spindles in wafer grinders (8461), cast iron with minimal machining for sprue removal and mounting tabs. Used post-slicing to grind wafers to tolerance for semiconductor fab. 8466.93.60.60 due to basic processing state.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If with integrated plain shaft bearings
Crankshaft/camshaft housings or similar classify under transmission parts.
If for unspecified wafer processing machines
Broader semiconductor apparatus parts go to other Chapter 84 machines.
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Import Tips & Compliance
• Specify 'not advanced beyond cleaning' in commercial invoice; include process flowcharts; check for Section 301 tariffs
Related Products under HTS 8466.93.60.60
Cast Iron Wafer Polisher Frame Assembly Base
Base frame for wafer polishers achieving flatness for fab processing, minimal cast iron machining under 8466.93.60.60 for heading 8461 equipment.
Cast Iron Crystal Puller Support Arm
Support arm casting for Czochralski pullers, gate-cleaned only, 8466.93.60.60 for 8461.
Cast Iron Wafer Saw Alignment Bracket
Bracket for saw alignment in wafer slicing, basic machining, 8466.93.60.60.
Cast Iron Boule Grinder Fixture Plate
Fixture plate for grinding semiconductor crystal boules to diameter specs, cast iron cleaned and located per 8466.93.60.60 for 8461 grinders. Indicates conductivity via flat grinding as per statistical note.
Cast Iron Wafer Crystal Puller Mounting Base
This cast iron base is machined solely to remove casting fins and gates, designed for precise mounting of crystal pullers used in semiconductor boule production under heading 8461. It ensures stability during the Czochralski process for growing monocrystalline silicon ingots. Classifies under 8466.93.60.60 as a cast-iron part not advanced beyond basic cleaning and minimal machining for semiconductor machines.
Cast Iron Wafer Slicing Saw Bed Frame
A cast iron frame for wafer slicing saws under heading 8461, cleaned and machined only at locational points for assembly in semiconductor wafer preparation. It supports precise slicing of monocrystalline boules into wafers. Meets 8466.93.60.60 criteria for minimal processing on cast-iron parts.