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8466.93.15.60/Cast-Iron Semiconductor Lapper Frame Casting/Japan

Cast-Iron Semiconductor Lapper Frame Casting from Japan

Cast-iron frame casting for wafer lapping machines (stat note a)(ii)(C), cleaned and minimally machined for assembly fixturing only. Provides structural support for lap plate drive. HTS 8466.93.15.60 frame castings.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include wafer size specs (4-12 inch) for stat note validation

• Avoid plating or coatings that suggest completion