Wafer Slicing Saw Work Clamp from Germany
Adjustable clamp assembly that secures semiconductor wafers or partial boules during slicing operations in wafer slicing saws, compatible with heading 8465 sawing machines. Falls under HTS 8466.20.80.65 as an other work holder essential for precise kerf control in semiconductor wafer preparation. Aligns with statistical notes for equipment slicing wafers from monocrystalline material.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Provide evidence of diamond blade compatibility and wafer thickness specs; ensure documentation links to semiconductor boule slicing; avoid bulk packaging that suggests general tooling use