Wafer Slicing Saw Work Clamp from China
Adjustable clamp assembly that secures semiconductor wafers or partial boules during slicing operations in wafer slicing saws, compatible with heading 8465 sawing machines. Falls under HTS 8466.20.80.65 as an other work holder essential for precise kerf control in semiconductor wafer preparation. Aligns with statistical notes for equipment slicing wafers from monocrystalline material.
Duty Rate — China → United States
41.2%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Provide evidence of diamond blade compatibility and wafer thickness specs; ensure documentation links to semiconductor boule slicing; avoid bulk packaging that suggests general tooling use