Wafer Slicing Saw Work Clamp from China
Adjustable clamp assembly that secures semiconductor wafers or partial boules during slicing operations in wafer slicing saws, compatible with heading 8465 sawing machines. Falls under HTS 8466.20.80.65 as an other work holder essential for precise kerf control in semiconductor wafer preparation. Aligns with statistical notes for equipment slicing wafers from monocrystalline material.
Duty Rate — China → United States
38.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Provide evidence of diamond blade compatibility and wafer thickness specs; ensure documentation links to semiconductor boule slicing; avoid bulk packaging that suggests general tooling use