Wafer Slicing Saw Work Clamp from Canada
Adjustable clamp assembly that secures semiconductor wafers or partial boules during slicing operations in wafer slicing saws, compatible with heading 8465 sawing machines. Falls under HTS 8466.20.80.65 as an other work holder essential for precise kerf control in semiconductor wafer preparation. Aligns with statistical notes for equipment slicing wafers from monocrystalline material.
Duty Rate — Canada → United States
13.7%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide evidence of diamond blade compatibility and wafer thickness specs; ensure documentation links to semiconductor boule slicing; avoid bulk packaging that suggests general tooling use