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8466.20.80.65/Wafer Backside Grinder Clamp/Japan

Wafer Backside Grinder Clamp from Japan

Clamp securing wafers for backside thinning/grinding in preparation equipment. HTS 8466.20.80.65 other work holder.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Thickness control specs; anti-static coating proof; machine-specific docs