Wafer Backside Grinder Clamp from Japan
Clamp securing wafers for backside thinning/grinding in preparation equipment. HTS 8466.20.80.65 other work holder.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Thickness control specs; anti-static coating proof; machine-specific docs