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Wafer Backside Grinder Clamp from Germany

Clamp securing wafers for backside thinning/grinding in preparation equipment. HTS 8466.20.80.65 other work holder.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

Import Tips

Thickness control specs; anti-static coating proof; machine-specific docs