Wafer Backside Grinder Clamp from Germany

Clamp securing wafers for backside thinning/grinding in preparation equipment. HTS 8466.20.80.65 other work holder.

Duty Rate — Germany → United States

13.7%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Import Tips

Thickness control specs; anti-static coating proof; machine-specific docs

Wafer Backside Grinder Clamp from Germany — Import Duty Rate | HTS 8466.20.80.65