Wafer Backside Grinder Clamp from Germany
Clamp securing wafers for backside thinning/grinding in preparation equipment. HTS 8466.20.80.65 other work holder.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Thickness control specs; anti-static coating proof; machine-specific docs