Semiconductor Wafer Chuck from Germany
A vacuum or electrostatic chuck designed to securely hold silicon wafers during processing in machines like grinders, polishers, or etchers from headings 8464 or 8465. It is classified under HTS 8466.20.80.65 as a work holder specifically for semiconductor manufacturing equipment used in wafer preparation steps such as grinding and polishing. This accessory ensures precise positioning and minimal contamination during high-precision operations.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Verify compatibility with specific machines in headings 8456-8465 via manufacturer specs; obtain certificates confirming sole use in semiconductor processing to avoid reclassification; ensure cleanroom-grade materials meet contamination standards