Semiconductor Wafer Chuck from China
A vacuum or electrostatic chuck designed to securely hold silicon wafers during processing in machines like grinders, polishers, or etchers from headings 8464 or 8465. It is classified under HTS 8466.20.80.65 as a work holder specifically for semiconductor manufacturing equipment used in wafer preparation steps such as grinding and polishing. This accessory ensures precise positioning and minimal contamination during high-precision operations.
Duty Rate — China → United States
38.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Verify compatibility with specific machines in headings 8456-8465 via manufacturer specs; obtain certificates confirming sole use in semiconductor processing to avoid reclassification; ensure cleanroom-grade materials meet contamination standards