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8466.20.80.65/Polish Pad Wafer Frame/Japan

Polish Pad Wafer Frame from Japan

Frame that secures wafers against polish pads in chemical mechanical polishers (CMP) classified under heading 8464. HTS 8466.20.80.65 for other work holders in semiconductor surface preparation equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Detail CMP slurry compatibility; ensure frame material is non-contaminating; link to specific polisher models