Polish Pad Wafer Frame from Germany
Frame that secures wafers against polish pads in chemical mechanical polishers (CMP) classified under heading 8464. HTS 8466.20.80.65 for other work holders in semiconductor surface preparation equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Detail CMP slurry compatibility; ensure frame material is non-contaminating; link to specific polisher models