Polish Pad Wafer Frame from Germany
Frame that secures wafers against polish pads in chemical mechanical polishers (CMP) classified under heading 8464. HTS 8466.20.80.65 for other work holders in semiconductor surface preparation equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Detail CMP slurry compatibility; ensure frame material is non-contaminating; link to specific polisher models