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8466.20.80.65/Polish Pad Wafer Frame/China

Polish Pad Wafer Frame from China

Frame that secures wafers against polish pads in chemical mechanical polishers (CMP) classified under heading 8464. HTS 8466.20.80.65 for other work holders in semiconductor surface preparation equipment.

Duty Rate — China → United States

41.2%

Rate breakdown

9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
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Import Tips

• Detail CMP slurry compatibility; ensure frame material is non-contaminating; link to specific polisher models