Polish Pad Wafer Frame from Canada
Frame that secures wafers against polish pads in chemical mechanical polishers (CMP) classified under heading 8464. HTS 8466.20.80.65 for other work holders in semiconductor surface preparation equipment.
Duty Rate — Canada → United States
13.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Detail CMP slurry compatibility; ensure frame material is non-contaminating; link to specific polisher models