Edge Grinding Wafer Fixture from Japan
Fixture for holding wafers during edge grinding to precise diameters post-slicing, for grinders in heading 8464. Other work holder under HTS 8466.20.80.65 for wafer manufacturing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Certify for 300mm wafer support; include edge profile specs; avoid general machine shop classification