Wafer Slicing Saw Alignment Jig from Japan
Jig that precisely aligns semiconductor boules in wafer slicing saws (heading 8460) to ensure parallel cuts for uniform wafer thickness from monocrystalline material. Critical work holder for maintaining tolerances in semiconductor wafer preparation. HTS 8466.20.8040 for such specialized fixtures.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include wafer thickness tolerance specs (<1 micron) in invoices to prove semiconductor-specific design
• Obtain advance ruling if jig adaptable to non-semiconductor saws to prevent 8487 reclassification
• Ensure diamond wire compatibility certification for customs verification