Wafer Slicing Saw Alignment Jig from China
Jig that precisely aligns semiconductor boules in wafer slicing saws (heading 8460) to ensure parallel cuts for uniform wafer thickness from monocrystalline material. Critical work holder for maintaining tolerances in semiconductor wafer preparation. HTS 8466.20.8040 for such specialized fixtures.
Duty Rate — China → United States
38.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Include wafer thickness tolerance specs (<1 micron) in invoices to prove semiconductor-specific design
• Obtain advance ruling if jig adaptable to non-semiconductor saws to prevent 8487 reclassification
• Ensure diamond wire compatibility certification for customs verification