Semiconductor Wafer Grinding Jig from China
Precision jig designed to securely hold semiconductor crystal boules during grinding to exact diameters for wafer production. It ensures alignment and stability for machines in headings 8456-8465 used in semiconductor manufacturing. Classified under 8466.20.8040 as a work holder jig for such specialized equipment.
Duty Rate — China → United States
38.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Provide detailed technical specs proving use solely with 8456-8465 machines for semiconductor processing to justify 'jigs and fixtures' classification
• Include end-user certificates from semiconductor fabs to prevent reclassification to Chapter 90 testing apparatus
• Ensure FDA or cleanroom compatibility docs if for silicon wafer prep to avoid customs holds