Wafer Slicing Saw from Japan
Precision saw designed to slice thin wafers from monocrystalline semiconductor boules, such as silicon crystals produced by Czochralski method. Classified under HTS 8465.96.00 as a slicing machine for hard materials like semiconductor crystals, aligning with statistical notes for wafer preparation equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Verify machine specifications confirm use for hard semiconductor materials to avoid reclassification to Chapter 84 general saws
• Include technical datasheets and end-use declarations for semiconductor fabrication to support correct HTS classification
• Ensure compliance with export controls on semiconductor equipment under BIS regulations