Wafer Slicing Saw from Japan
Precision saw designed to slice thin wafers from monocrystalline semiconductor boules, such as silicon crystals produced by Czochralski method. Classified under HTS 8465.96.00 as a slicing machine for hard materials like semiconductor crystals, aligning with statistical notes for wafer preparation equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Verify machine specifications confirm use for hard semiconductor materials to avoid reclassification to Chapter 84 general saws
• Include technical datasheets and end-use declarations for semiconductor fabrication to support correct HTS classification
• Ensure compliance with export controls on semiconductor equipment under BIS regulations