Gallium Arsenide Wafer Slicing Saw from Japan
Specialized slicing saw for compound semiconductors like GaAs boules, maintaining crystal orientation during wafer separation. Classified in 8465.96.00 for slicing hard semiconductor materials as defined in statistical notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify compound semiconductor compatibility to justify specialized hard materials classification
• Maintain traceability documentation for boule-to-wafer process validation
• Watch for EAR controls on equipment for advanced compound semiconductors