Gallium Arsenide Wafer Slicing Saw from China
Specialized slicing saw for compound semiconductors like GaAs boules, maintaining crystal orientation during wafer separation. Classified in 8465.96.00 for slicing hard semiconductor materials as defined in statistical notes.
Duty Rate — China → United States
22.4%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Specify compound semiconductor compatibility to justify specialized hard materials classification
• Maintain traceability documentation for boule-to-wafer process validation
• Watch for EAR controls on equipment for advanced compound semiconductors