Diamond Wire Wafer Slicer from Mexico
Multi-wire diamond saw employing fixed abrasive technology to simultaneously slice multiple wafers from silicon boules. HTS 8465.96.00 includes this slicing machine technology for semiconductor wafer preparation.
Duty Rate — Mexico → United States
12.4%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Include wire tension and slurry specifications to document semiconductor precision requirements
• Certify diamond wire as integral component for complete machine classification
• Validate cleanroom compatibility ratings for import documentation