Diamond Wire Wafer Slicer from Japan
Multi-wire diamond saw employing fixed abrasive technology to simultaneously slice multiple wafers from silicon boules. HTS 8465.96.00 includes this slicing machine technology for semiconductor wafer preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include wire tension and slurry specifications to document semiconductor precision requirements
• Certify diamond wire as integral component for complete machine classification
• Validate cleanroom compatibility ratings for import documentation