Diamond Wire Wafer Slicer from Germany
Multi-wire diamond saw employing fixed abrasive technology to simultaneously slice multiple wafers from silicon boules. HTS 8465.96.00 includes this slicing machine technology for semiconductor wafer preparation.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include wire tension and slurry specifications to document semiconductor precision requirements
• Certify diamond wire as integral component for complete machine classification
• Validate cleanroom compatibility ratings for import documentation