Diamond Wire Wafer Slicer from Germany
Multi-wire diamond saw employing fixed abrasive technology to simultaneously slice multiple wafers from silicon boules. HTS 8465.96.00 includes this slicing machine technology for semiconductor wafer preparation.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include wire tension and slurry specifications to document semiconductor precision requirements
• Certify diamond wire as integral component for complete machine classification
• Validate cleanroom compatibility ratings for import documentation