Crystal Boule Slicing Machine from Mexico
High-precision machine using diamond wire or blades to slice semiconductor boules into individual wafers for device fabrication. Falls under 8465.96.00 as a slicing machine specifically for hard materials like silicon and gallium arsenide crystals.
Duty Rate — Mexico → United States
12.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide evidence of semiconductor end-use to distinguish from general wood/plastics slicing machines
• Document precision tolerances (micron-level) in import filings to justify hard materials classification
• Check for anti-dumping duties on precision saws from certain Asian manufacturers