Crystal Boule Slicing Machine from China
High-precision machine using diamond wire or blades to slice semiconductor boules into individual wafers for device fabrication. Falls under 8465.96.00 as a slicing machine specifically for hard materials like silicon and gallium arsenide crystals.
Duty Rate — China → United States
19.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Provide evidence of semiconductor end-use to distinguish from general wood/plastics slicing machines
• Document precision tolerances (micron-level) in import filings to justify hard materials classification
• Check for anti-dumping duties on precision saws from certain Asian manufacturers