Crystal Boule Slicing Machine from Canada
High-precision machine using diamond wire or blades to slice semiconductor boules into individual wafers for device fabrication. Falls under 8465.96.00 as a slicing machine specifically for hard materials like silicon and gallium arsenide crystals.
Duty Rate — Canada → United States
12.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide evidence of semiconductor end-use to distinguish from general wood/plastics slicing machines
• Document precision tolerances (micron-level) in import filings to justify hard materials classification
• Check for anti-dumping duties on precision saws from certain Asian manufacturers