8465.96.00.40/Wafer Edge Grinding Machine/Japan

Wafer Edge Grinding Machine from Japan

Precision grinder for chamfering and profiling wafer edges to prevent chipping during handling and processing in semiconductor lines. Ensures wafer integrity pre-fab. HTS 8465.96.0040 as specialized paring machine.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify edge profiles (e.g

• full chamfer, half radius) per SEMI standards

• Document throughput rates matching high-volume wafer fabs

• Avoid declaring as 'universal grinder'; specify semiconductor wafer application