Wafer Edge Grinding Machine from China
Precision grinder for chamfering and profiling wafer edges to prevent chipping during handling and processing in semiconductor lines. Ensures wafer integrity pre-fab. HTS 8465.96.0040 as specialized paring machine.
Duty Rate — China → United States
22.4%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Specify edge profiles (e.g
• full chamfer, half radius) per SEMI standards
• Document throughput rates matching high-volume wafer fabs
• Avoid declaring as 'universal grinder'; specify semiconductor wafer application